Capability

Software Design

  • Embedded control
  • Hardware Testing Code
  • BIOS Customization
  • Real Time Operating System (RTOS)Integration
  • CE.Net, Symbian, Embedded Linux, EmbeddedWindows, Android
  • Drivers & Applications
  • Industry Standard Chipsets
  • High Level Languages (C, C++, Visual C++,VB)
  • Low Level Firmware (Assembly)
  • Requirements Analysis
  • Concept Design
  • System Architecture
  • Board Support Package (BSP) and DriverDevelopment
  • Embedded Application Development
  • User Interface Design
  • Protocol Implementation
  • Software Verification Test
  • Diagnostics Software Design

Mechanism Design

  • Enclosures fromMiniature to Massive
  • Sheet Metal
  • Cast (Metal andPlastic)
  • Precision Mechanics and Mechatronics
  • 3D Modeling
  • Thermal,Acoustic Analysis
  • Structural Analysis
  • Prototyping

Manufacturing Readiness

  • ToolingManagement
  • Tooling Cost /Risk Analysis
  • VendorEvaluation and Selection

Industrial Design

  • Ergonomics
  • Concept Generation
  • Graphics Generation

Thermal Design

  • Thermal Architecture
  • Thermal Analysis, Computational Fluid Dynamics (CFD) Modeling
  • Board Level,Chip Level, Package Level Thermal Design
  • Heat sink Design, Selection and Customization
  • Detailed Comprehensive Thermal Test Plan and Report

Electrical Design

  • Analog/Digital/High Speed Digital
  • FieldProgrammable Gate Arrays (FPGAs)
  • ComplexProgrammable Logic Devices (CPLDs)
  • USB, IEEE 1394,Low Voltage Differential Signaling (LVDS)
  • PCI, PCIExtended (PCI-X), DDR SDRAM
  • Multipoint ControlUnit (MCU), Digital Signal Processor (DSP) Embedded System
  • SignalProcessing
  • Power Supply
  • ZigBee
  • ElectricalVerification Test (EVT), Design Verification Test (DVT), Circuit Board BringUp/Debug
  • Signal and PowerIntegrity Testing
  • SystemIntegration
  • ElectricalSystem Design
  • ElectronicComponents Selection
  • Schematic DesignAnd Layout
  • Bill of Material(BOM) Creation and Release
  • Circuit BoardBuilding Support
  • FunctionalTesting
  • SystemVerification
  • Pilot Support
  • Schematic Capture

Value-added engineering

Cost Reduction Analysis

  • Bill of MaterialAnalysis
  • ElectricalAnalysis
  • MechanicalAnalysis
  • Fab Analysis

Component Engineering

  • Approved VendorList (AVL) Expansion
  • StrategicCross-Vendor Bill of Material (BOM) Analysis
  • Spend LeverageAnalysis
  • Restriction ofHazardous Materials / Waste Electrical and Electronic Equipment (RoHS/WEEE)Compliance
  • ObsolescenceResolution
  • Life Cycle /Risk Analysis

Design for Excellence Review &Analysis

  • Printed CircuitBoard Assembly Analysis
  • Design forManufacturing
  • Fab Design forManufacturing
  • MechanicalDesign for Assembly
  • Mean TimeBetween Failure (MTBF) Analysis

Engineering New Product IntroductionSupport

  • Early SupplierInvolvement
  • Proto BuildSupport
  • ManufacturingDefect Analysis
  • Product Teardown
  • ManufacturingAssembly Analysis
  • MaynardOperations Sequence Technique (MOST) Analysis
  • BoothroydDewhurst Techniques
  • CompetitiveComparisons
  • ReverseEngineering